Parameters | |
---|---|
Factory Lead Time | 1 Week |
Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | A, Axial |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 1996 |
JESD-609 Code | e0 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | Not Applicable |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | TIN LEAD |
Max Operating Temperature | 175°C |
Min Operating Temperature | -55°C |
HTS Code | 8541.10.00.80 |
Terminal Position | END |
Terminal Form | WRAP AROUND |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 2μA @ 100V |
Voltage - Forward (Vf) (Max) @ If | 975mV @ 1A |
Case Connection | ISOLATED |
Forward Current | 1A |
Operating Temperature - Junction | -55°C~175°C |
Output Current-Max | 1A |
Forward Voltage | 975mV |
Max Reverse Voltage (DC) | 100V |
Average Rectified Current | 1A |
Reverse Recovery Time | 25 ns |
Peak Reverse Current | 2μA |
Max Repetitive Reverse Voltage (Vrrm) | 100V |
Peak Non-Repetitive Surge Current | 30A |
Radiation Hardening | No |
RoHS Status | Non-RoHS Compliant |