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V-1100-SMD/B-L

HEAT SINK COPPER DPAK TO-252


  • Manufacturer: Assmann WSW Components
  • Nocochips NO: 93-V-1100-SMD/B-L
  • Package: TO-252
  • Datasheet: -
  • Stock: 371
  • Description: HEAT SINK COPPER DPAK TO-252 (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mount Surface Mount
Package / Case TO-252
Material Copper
Shape Rectangular, Fins
Package Cooled TO-252 (DPak)
Material Finish Tin
Published 2014
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type Top Mount
Attachment Method SMD Pad
Height Off Base (Height of Fin) 0.390 9.91mm
Thermal Resistance @ Natural 25.00°C/W
Length 0.320 8.13mm
Width 0.790 20.07mm
RoHS Status ROHS3 Compliant
See Relate Datesheet

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