VBO19-08NO7
| Parameters | |
|---|---|
| Mount | Chassis Mount |
| Mounting Type | Chassis Mount |
| Package / Case | Slim-PAC |
| Diode Element Material | SILICON |
| Operating Temperature | -40°C~150°C TJ |
| Packaging | Bulk |
| Published | 2003 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 4 |
| HTS Code | 8541.10.00.80 |
| Technology | Standard |
| Terminal Position | UPPER |
| Terminal Form | UNSPECIFIED |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-XUFM-X4 |
| Qualification Status | Not Qualified |
| Number of Elements | 4 |
| Configuration | BRIDGE, 4 ELEMENTS |
| Diode Type | Single Phase |
| Current - Reverse Leakage @ Vr | 300μA @ 800V |
| Voltage - Forward (Vf) (Max) @ If | 1.12V @ 7A |
| Case Connection | ISOLATED |
| Max Reverse Leakage Current | 300μA |
| Max Surge Current | 100A |
| Average Rectified Current | 21A |
| Number of Phases | 1 |
| Non-rep Pk Forward Current-Max | 90A |
| Voltage - Peak Reverse (Max) | 800V |
| Height | 6mm |
| Length | 47mm |
| Width | 30.3mm |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
