Parameters | |
---|---|
Min Operating Temperature | -40°C |
HTS Code | 8541.10.00.80 |
Terminal Position | SINGLE |
Peak Reflow Temperature (Cel) | NOT APPLICABLE |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT APPLICABLE |
Number of Elements | 1 |
Element Configuration | Common Cathode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 50μA @ 800V |
Voltage - Forward (Vf) (Max) @ If | 1.1V @ 10A |
Forward Current | 10A |
Operating Temperature - Junction | -40°C~150°C |
Application | HIGH VOLTAGE |
Forward Voltage | 1.1V |
Max Reverse Voltage (DC) | 800V |
Average Rectified Current | 10A |
Number of Phases | 1 |
Peak Reverse Current | 50μA |
Max Repetitive Reverse Voltage (Vrrm) | 800V |
Peak Non-Repetitive Surge Current | 200A |
Max Forward Surge Current (Ifsm) | 200A |
Height | 9.02mm |
Length | 10.66mm |
Width | 4.82mm |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-220-2 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Tube |
Published | 2015 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Max Operating Temperature | 150°C |