Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-220-2 |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 1997 |
JESD-609 Code | e3 |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Terminal Finish | Matte Tin (Sn) - with Nickel (Ni) barrier |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
HTS Code | 8541.10.00.80 |
Base Part Number | 10ETS08 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 50μA @ 800V |
Voltage - Forward (Vf) (Max) @ If | 1.1V @ 10A |
Case Connection | CATHODE |
Forward Current | 10A |
Operating Temperature - Junction | -40°C~150°C |
Max Surge Current | 200A |
Application | GENERAL PURPOSE |
Forward Voltage | 1V |
Max Reverse Voltage (DC) | 800V |
Average Rectified Current | 10A |
Number of Phases | 1 |
Peak Reverse Current | 50μA |
Max Repetitive Reverse Voltage (Vrrm) | 800V |
Peak Non-Repetitive Surge Current | 200A |
Reverse Voltage | 800V |
Max Forward Surge Current (Ifsm) | 175A |
Natural Thermal Resistance | 0.5 °C/W |
Height | 9.02mm |
Length | 10.66mm |
Width | 4.82mm |
Radiation Hardening | No |
REACH SVHC | Unknown |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |