Parameters | |
---|---|
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 1 |
ECCN Code | EAR99 |
Terminal Finish | Tin (Sn) - with Nickel (Ni) barrier |
Max Operating Temperature | 175°C |
Min Operating Temperature | -65°C |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | SOLDER LUG |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | O-MUPM-D1 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard, Reverse Polarity |
Voltage - Forward (Vf) (Max) @ If | 1.3V @ 78A |
Case Connection | ANODE |
Operating Temperature - Junction | -65°C~175°C |
Application | GENERAL PURPOSE |
Voltage - DC Reverse (Vr) (Max) | 1200V |
Forward Voltage | 1.3V |
Max Reverse Voltage (DC) | 1.2kV |
Average Rectified Current | 25A |
Number of Phases | 1 |
Peak Non-Repetitive Surge Current | 373A |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mount | Chassis, Stud |
Mounting Type | Chassis, Stud Mount |
Package / Case | DO-203AA, DO-4, Stud |
Number of Pins | 2 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2017 |
JESD-609 Code | e3 |
Part Status | Active |