VS-25FR60
| Parameters | |
|---|---|
| Operating Temperature - Junction | -65°C~175°C |
| Max Surge Current | 373A |
| Application | GENERAL PURPOSE |
| Breakdown Voltage | 600V |
| Forward Voltage | 1.3V |
| Max Reverse Voltage (DC) | 600V |
| Average Rectified Current | 25A |
| Number of Phases | 1 |
| Peak Reverse Current | 12mA |
| Max Repetitive Reverse Voltage (Vrrm) | 600V |
| Peak Non-Repetitive Surge Current | 373A |
| Reverse Voltage | 600V |
| Max Forward Surge Current (Ifsm) | 373A |
| Natural Thermal Resistance | 0.5 °C/W |
| Height | 31.8mm |
| Length | 12.69mm |
| Width | 11mm |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
| Factory Lead Time | 1 Week |
| Mount | Chassis, Stud |
| Mounting Type | Chassis, Stud Mount |
| Package / Case | DO-203AA, DO-4, Stud |
| Number of Pins | 2 |
| Diode Element Material | SILICON |
| Packaging | Bulk |
| Published | 2008 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 1 |
| ECCN Code | EAR99 |
| Terminal Finish | Tin (Sn) - with Nickel (Ni) barrier |
| Max Operating Temperature | 175°C |
| Min Operating Temperature | -65°C |
| HTS Code | 8541.10.00.80 |
| Terminal Position | UPPER |
| Terminal Form | SOLDER LUG |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | O-MUPM-D1 |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Standard Recovery >500ns, > 200mA (Io) |
| Diode Type | Standard, Reverse Polarity |
| Voltage - Forward (Vf) (Max) @ If | 1.3V @ 78A |
| Case Connection | ANODE |
| Forward Current | 25A |
See Relate Datesheet
