Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis, Stud |
Mounting Type | Chassis, Stud Mount |
Package / Case | DO-203AB, DO-5, Stud |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2017 |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 1 |
Terminal Finish | Tin (Sn) - with Nickel (Ni) barrier |
Max Operating Temperature | 125°C |
Min Operating Temperature | -40°C |
Additional Feature | FREE WHEELING DIODE |
Terminal Position | UPPER |
Terminal Form | SOLDER LUG |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | O-MUPM-D1 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 100μA @ 100V |
Case Connection | CATHODE |
Forward Current | 85A |
Operating Temperature - Junction | -40°C~125°C |
Max Surge Current | 1.151kA |
Max Reverse Voltage (DC) | 100V |
Average Rectified Current | 85A |
Number of Phases | 1 |
Reverse Recovery Time | 200 ns |
Peak Reverse Current | 100μA |
Reverse Voltage | 100V |
Forward Voltage-Max | 1.75V |
Recovery Time | 200 ns |
Natural Thermal Resistance | 0.25 °C/W |
RoHS Status | ROHS3 Compliant |