Parameters | |
---|---|
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Additional Feature | PD-CASE, UL RECOGNIZED |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PUFM-X2 |
Number of Elements | 2 |
Element Configuration | Common Cathode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 4mA @ 480V |
Voltage - Forward (Vf) (Max) @ If | 2.1V @ 140A |
Forward Current | 140A |
Operating Temperature - Junction | -55°C~150°C |
Max Surge Current | 400A |
Application | ULTRA FAST SOFT RECOVERY |
Max Reverse Voltage (DC) | 600V |
Average Rectified Current | 167A |
Number of Phases | 1 |
Reverse Recovery Time | 33 ns |
Peak Reverse Current | 20μA |
Max Repetitive Reverse Voltage (Vrrm) | 600V |
Peak Non-Repetitive Surge Current | 400A |
Reverse Voltage | 600V |
Diode Configuration | 1 Pair Common Cathode |
Recovery Time | 120 ns |
RoHS Status | ROHS3 Compliant |
Factory Lead Time | 1 Week |
Mount | Chassis Mount, Screw |
Mounting Type | Chassis Mount |
Package / Case | TO-244AB |
Number of Pins | 3 |
Diode Element Material | SILICON |
Packaging | Tray |
Published | 2016 |
Series | HEXFRED® |