Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Diode Element Material | SILICON |
Packaging | Tape & Reel (TR) |
Published | 2013 |
Series | HEXFRED® |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Additional Feature | LOW NOISE |
HTS Code | 8541.10.00.80 |
Terminal Position | SINGLE |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | HFA16TA60C |
Reference Standard | AEC-Q101 |
JESD-30 Code | R-PSSO-G2 |
Number of Elements | 2 |
Power Dissipation-Max | 36W |
Element Configuration | Common Cathode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 5μA @ 600V |
Voltage - Forward (Vf) (Max) @ If | 1.7V @ 8A |
Operating Temperature - Junction | -55°C~150°C |
Max Surge Current | 60A |
Output Current-Max | 8A |
Application | EFFICIENCY |
Max Reverse Voltage (DC) | 600V |
Average Rectified Current | 8A |
Number of Phases | 1 |
Reverse Recovery Time | 55 ns |
Peak Reverse Current | 5μA |
Reverse Voltage | 600V |
Diode Configuration | 1 Pair Common Cathode |
Recovery Time | 55 ns |
RoHS Status | ROHS3 Compliant |