Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
Diode Element Material | SILICON |
Packaging | Tube |
Published | 2017 |
Series | Automotive, AEC-Q101, HEXFRED® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
HTS Code | 8541.10.00.80 |
Terminal Position | SINGLE |
Terminal Form | GULL WING |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PSSO-G2 |
Operating Temperature (Max) | 150°C |
Number of Elements | 1 |
Configuration | SINGLE |
Power Dissipation-Max | 151W |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 20μA @ 1200V |
Voltage - Forward (Vf) (Max) @ If | 3V @ 16A |
Operating Temperature - Junction | -55°C~150°C |
Application | EFFICIENCY |
Voltage - DC Reverse (Vr) (Max) | 1200V |
Max Reverse Voltage (DC) | 1.2kV |
Average Rectified Current | 16A |
Number of Phases | 1 |
Reverse Recovery Time | 90 ns |
Non-rep Pk Forward Current-Max | 190A |
Reverse Current-Max | 20μA |
RoHS Status | ROHS3 Compliant |