VS-HFA25TB60HN3
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | TO-220-2 |
| Diode Element Material | SILICON |
| Packaging | Tube |
| Published | 2014 |
| Series | HEXFRED® |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| HTS Code | 8541.10.00.80 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Reach Compliance Code | unknown |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Reference Standard | AEC-Q101 |
| JESD-30 Code | R-PSFM-T2 |
| Number of Elements | 1 |
| Power Dissipation-Max | 125W |
| Element Configuration | Single |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 20μA @ 600V |
| Voltage - Forward (Vf) (Max) @ If | 1.7V @ 25A |
| Case Connection | CATHODE |
| Operating Temperature - Junction | -55°C~150°C |
| Max Surge Current | 225A |
| Application | ULTRA FAST SOFT RECOVERY |
| Max Reverse Voltage (DC) | 600V |
| Average Rectified Current | 25A |
| Number of Phases | 1 |
| Reverse Recovery Time | 75 ns |
| Peak Reverse Current | 20μA |
| JEDEC-95 Code | TO-220AC |
| Non-rep Pk Forward Current-Max | 100A |
| Reverse Voltage | 600V |
| Recovery Time | 160 ns |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
