VS-HFA25TB60SPBF
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | TO-263-3, D2Pak (2 Leads + Tab), TO-263AB |
| Number of Pins | 3 |
| Diode Element Material | SILICON |
| Packaging | Tube |
| Published | 2009 |
| Series | HEXFRED® |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| ECCN Code | EAR99 |
| Terminal Finish | MATTE TIN OVER NICKEL |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| HTS Code | 8541.10.00.80 |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 10 |
| Base Part Number | HFA25TB60 |
| Pin Count | 3 |
| JESD-30 Code | R-PSSO-G2 |
| Number of Elements | 1 |
| Element Configuration | Single |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) |
| Diode Type | Standard |
| Current - Reverse Leakage @ Vr | 20μA @ 600V |
| Voltage - Forward (Vf) (Max) @ If | 1.7V @ 25A |
| Case Connection | CATHODE |
| Forward Current | 25A |
| Operating Temperature - Junction | -55°C~150°C |
| Max Surge Current | 225A |
| Application | EFFICIENCY |
| Current - Average Rectified (Io) | 25A DC |
| Forward Voltage | 2V |
| Max Reverse Voltage (DC) | 600V |
| Average Rectified Current | 25A |
| Number of Phases | 1 |
| Reverse Recovery Time | 75 ns |
| Peak Reverse Current | 20μA |
| Max Repetitive Reverse Voltage (Vrrm) | 600V |
| Peak Non-Repetitive Surge Current | 225A |
| Reverse Voltage | 600V |
| Max Forward Surge Current (Ifsm) | 225A |
| Recovery Time | 75 ns |
| Height | 4.83mm |
| Length | 10.67mm |
| Width | 9.65mm |
| Radiation Hardening | No |
| RoHS Status | ROHS3 Compliant |
See Relate Datesheet
