Parameters | |
---|---|
Factory Lead Time | 1 Week |
Contact Plating | Tin |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-220-3 |
Number of Pins | 3 |
Supplier Device Package | TO-220AB |
Packaging | Tube |
Published | 2008 |
Series | HEXFRED® |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Max Operating Temperature | 150°C |
Min Operating Temperature | -55°C |
Base Part Number | HFA30TA60C |
Element Configuration | Common Cathode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 10μA @ 600V |
Power Dissipation | 74W |
Voltage - Forward (Vf) (Max) @ If | 1.7V @ 15A |
Forward Current | 30A |
Operating Temperature - Junction | -55°C~150°C |
Max Surge Current | 150A |
Voltage - DC Reverse (Vr) (Max) | 600V |
Current - Average Rectified (Io) | 15A DC |
Forward Voltage | 2V |
Max Reverse Voltage (DC) | 600V |
Average Rectified Current | 15A |
Reverse Recovery Time | 60 ns |
Peak Reverse Current | 10μA |
Max Repetitive Reverse Voltage (Vrrm) | 600V |
Peak Non-Repetitive Surge Current | 150A |
Reverse Voltage | 600V |
Diode Configuration | 1 Pair Common Cathode |
Max Forward Surge Current (Ifsm) | 150A |
Recovery Time | 60 ns |
Height | 15.24mm |
Length | 10.4902mm |
Width | 4.6482mm |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |