Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis, Stud |
Mounting Type | Chassis, Stud Mount |
Package / Case | B-8 |
Number of Pins | 8 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2007 |
Pbfree Code | yes |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 1 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Terminal Position | UPPER |
Terminal Form | HIGH CURRENT CABLE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | O-CUPM-H1 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 35mA @ 3200V |
Voltage - Forward (Vf) (Max) @ If | 1.44V @ 1500A |
Case Connection | CATHODE |
Operating Temperature - Junction | -40°C~150°C |
Max Surge Current | 11kA |
Application | HIGH VOLTAGE HIGH POWER |
Voltage - DC Reverse (Vr) (Max) | 3200V |
Max Reverse Voltage (DC) | 3.2kV |
Average Rectified Current | 600A |
Number of Phases | 1 |
Peak Reverse Current | 35mA |
Non-rep Pk Forward Current-Max | 11000A |
Reverse Voltage | 3.2kV |
Natural Thermal Resistance | 0.04 °C/W |
RoHS Status | ROHS3 Compliant |