Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis Mount |
Mounting Type | Chassis Mount |
Package / Case | D-55 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2015 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Additional Feature | UL RECOGNIZED |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PUFM-X2 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 18mA @ 2200V |
Voltage - Forward (Vf) (Max) @ If | 1.5V @ 60A |
Case Connection | ISOLATED |
Forward Current | 20A |
Operating Temperature - Junction | -40°C~150°C |
Application | HIGH VOLTAGE POWER |
Voltage - DC Reverse (Vr) (Max) | 2200V |
Max Reverse Voltage (DC) | 2.2kV |
Average Rectified Current | 20A |
Number of Phases | 1 |
Peak Reverse Current | 18mA |
Max Repetitive Reverse Voltage (Vrrm) | 2.2kV |
Peak Non-Repetitive Surge Current | 450A |
RoHS Status | ROHS3 Compliant |