Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis Mount |
Mounting Type | Chassis Mount |
Package / Case | D-55 T-Module |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2009 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Additional Feature | UL APPROVED |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | unknown |
Current Rating | 85A |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PUFM-X2 |
Number of Elements | 1 |
Element Configuration | Single |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 20mA @ 1000V |
Case Connection | ISOLATED |
Max Surge Current | 1.8kA |
Application | HIGH VOLTAGE POWER |
Voltage - DC Reverse (Vr) (Max) | 1000V |
Max Reverse Voltage (DC) | 1kV |
Average Rectified Current | 85A |
Number of Phases | 1 |
Peak Reverse Current | 20mA |
Non-rep Pk Forward Current-Max | 1800A |
Reverse Voltage | 1kV |
Forward Voltage-Max | 1.27V |
RoHS Status | ROHS3 Compliant |