Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis Mount, Screw |
Mounting Type | Chassis Mount |
Package / Case | INT-A-PAK (3) |
Number of Pins | 3 |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2013 |
Series | HEXFRED® |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Max Operating Temperature | 150°C |
Min Operating Temperature | -40°C |
Additional Feature | PD-CASE, UL RECOGNIZED |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Number of Elements | 2 |
Power Dissipation-Max | 695W |
Element Configuration | Common Cathode |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 30mA @ 1200V |
Voltage - Forward (Vf) (Max) @ If | 3.2V @ 100A |
Case Connection | ISOLATED |
Forward Current | 100A |
Operating Temperature - Junction | -40°C~150°C |
Output Current-Max | 205A |
Application | ULTRA FAST RECOVERY |
Voltage - DC Reverse (Vr) (Max) | 1200V |
Current - Average Rectified (Io) | 102.5A DC |
Max Reverse Voltage (DC) | 1.2kV |
Average Rectified Current | 102.5A |
Number of Phases | 1 |
Reverse Recovery Time | 200 ns |
Peak Reverse Current | 30mA |
Max Repetitive Reverse Voltage (Vrrm) | 1.2kV |
Diode Configuration | 1 Pair Common Cathode |
Radiation Hardening | No |
RoHS Status | ROHS3 Compliant |