Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Chassis Mount |
Mounting Type | Chassis Mount |
Package / Case | TO-244AB |
Diode Element Material | SILICON |
Packaging | Bulk |
Published | 2016 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 2 |
ECCN Code | EAR99 |
Additional Feature | UL RECOGNIZED |
HTS Code | 8541.10.00.80 |
Terminal Position | UPPER |
Terminal Form | UNSPECIFIED |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Reach Compliance Code | unknown |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-PUFM-X2 |
Operating Temperature (Max) | 175°C |
Number of Elements | 2 |
Element Configuration | Common Anode |
Speed | Standard Recovery >500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 200μA @ 600V |
Voltage - Forward (Vf) (Max) @ If | 1.31V @ 200A |
Operating Temperature - Junction | -40°C~175°C |
Application | GENERAL PURPOSE |
Max Reverse Voltage (DC) | 600V |
Average Rectified Current | 200A |
Number of Phases | 1 |
Non-rep Pk Forward Current-Max | 2620A |
Diode Configuration | 1 Pair Common Anode |
Reverse Current-Max | 200μA |
RoHS Status | ROHS3 Compliant |