VSC7104XVP-01
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mount | Surface Mount |
| Mounting Type | Surface Mount |
| Package / Case | 36-FBGA |
| Supplier Device Package | 69-BGA |
| Operating Temperature | 0°C~110°C |
| Packaging | Tray |
| Published | 2004 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Max Operating Temperature | 110°C |
| Min Operating Temperature | 0°C |
| Power (Watts) | 1.5W |
| Max Power Dissipation | 1.5W |
| Voltage - Supply | 2.5V 3.3V |
| Function | Quad Signal Conditioner |
| Interface | TTL/CMOS |
| Number of Circuits | 4 |
| RoHS Status | ROHS3 Compliant |
VSC7104XVP-01 Overview
In order to save space on the board, 36-FBGA packages are used.A Tray-packing method is used to pack telecommunications equipment.There is a type Surface Mount mount for this telecom circuit.A 4-circuit composes this telecom IC .Improved efficiency can be ensured when the supply voltage of 2.5V 3.3V is provided.Operating temperatures of 0°C~110°C can ensure reliable performance.Surface Mount is the way telecom switching is mounted.Ensure normal operation by setting the temperature to 0°C minimum.In order to maintain normal operation, 110°C must be set at its maximum value.
VSC7104XVP-01 Features
Available in the 36-FBGA package
VSC7104XVP-01 Applications
There are a lot of Microchip Technology VSC7104XVP-01 Telecom applications.
- PBX (Private Branch Exchange)
- Short/Medium Loop
- PBX interfaces
- Multichannel DS1 Test Equipment
- CSU/DSU Equipment
- E1 Network Equipment
- Stations
- E2 Rates PCM Line Interface
- Remote wireless modules
- Microwave transmission systems
