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VSC7113XJW

Telecom device2 Circuits


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-VSC7113XJW
  • Package: 32-TFQFN Exposed Pad
  • Datasheet: -
  • Stock: 450
  • Description: Telecom device2 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 32-TFQFN Exposed Pad
Supplier Device Package 32-QFN (5x5)
Operating Temperature -40°C~110°C
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 2.5V
Function Signal Conditioner
Number of Circuits 2
RoHS Status ROHS3 Compliant

VSC7113XJW Overview


In order to save space on the board, the 32-TFQFN Exposed Pad package is used.For telecommunications equipment packing, the Tray method is used.Telecommunications equipment is mounted using Surface Mount.2 circuits are used in this telecom IC .When 2.5V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.The operating temperature set at -40°C~110°C can offer reliable performance.

VSC7113XJW Features


Available in the 32-TFQFN Exposed Pad package

VSC7113XJW Applications


There are a lot of Microchip Technology VSC7113XJW Telecom applications.

  • Cable PC
  • Codec function on telephone switch line cards
  • Stations
  • Digital Cross-connect Systems (DCS)
  • Digital cross connects (DSX-1)
  • ISDN Primary Rate Interface
  • Remote wireless modules
  • T1 Digital Cross Connects (DSX-1)
  • Home Side Box
  • Integrated Access Devices (IADs)

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