VSC7421XJQ-04
| Parameters | |
|---|---|
| Lifecycle Status | NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Package / Case | TQFP |
| Supplier Device Package | 302-TQFP (24x24) |
| Packaging | Tray |
| Series | SparX™-III-17um |
| Part Status | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Voltage - Supply | 1V |
| Function | Ethernet Switch |
| Interface | Serial |
| Number of Circuits | 1 |
| Data Rate | 1 Gbps |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
VSC7421XJQ-04 Overview
TQFP package is used to save board space.Packing is done according to the Tray method.The mounting type is Surface Mount.The telecom IC is composed of 1 circuits.Improved efficiency can be ensured when the supply voltage of 1V is provided.This part can perform many functions similar to the electronic parts under the SparX?-III-17um series.To ensure normal operation, -40°C must be set at a minimum value.Normal operation is ensured by setting 125°C to the maximum value.
VSC7421XJQ-04 Features
Available in the TQFP package
VSC7421XJQ-04 Applications
There are a lot of Microchip Technology VSC7421XJQ-04 Telecom applications.
- Interfaces to DS3
- Fiber to the Home (FTTH)
- SONET/SDH terminal
- T1 Digital Cross Connects (DSX-1)
- Public switching systems
- Digital Cross-Connect Systems
- CSU/DSU Equipment
- Channel Banks
- E1 Multiplexer
- T1/E1/J1 Performance Monitoring
