VSC7422XJQ-02
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Supplier Device Package | 302-TQFP (24x24) |
| Packaging | Tray |
| Series | SparX™-III-25um |
| Part Status | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 1V |
| Function | Ethernet Switch |
| Interface | Serial |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
VSC7422XJQ-02 Overview
Telecommunications equipment is packed according to Tray's method.Surface Mount is used as telecommunications equipment mounting type.A 1-circuit composes this telecom IC .When 1V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.There are many similar functions of the telecommunication product that it can provide with the electronic components under the SparX?-III-25um series.
VSC7422XJQ-02 Features
VSC7422XJQ-02 Applications
There are a lot of Microchip Technology VSC7422XJQ-02 Telecom applications.
- M13 MUX
- E1 Network Equipment
- T2 Rates PCM Line Interface
- Digital loop carrier (DLC)
- T1 Rates PCM Line Interface
- CSU/DSU E1 Interface
- ISDN NT1/TA
- CSU/DSU Equipment
- Interfaces to E3
- Wireless base stations
