Parameters |
Mounting Type |
Surface Mount |
Package / Case |
TQFP |
Supplier Device Package |
302-TQFP (24x24) |
Packaging |
Tray |
Series |
SparX™-III-25um |
Part Status |
Not For New Designs |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Max Operating Temperature |
125°C |
Min Operating Temperature |
-40°C |
Voltage - Supply |
1V |
Function |
Ethernet Switch |
Interface |
Serial |
Number of Circuits |
1 |
Data Rate |
1 Gbps |
Telecom IC Type |
SUPPORT CIRCUIT |
RoHS Status |
ROHS3 Compliant |
VSC7422XJQ-04 Overview
In order to save space on the board, TQFP packages are used.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount mounting type is used.Telecommunications equipment consists of 1 circuits.The voltage supplied to 1V can improve efficiency.The type of telecom IC it uses is SUPPORT CIRCUIT.It is able to provide a lots of similar functions of the telecommunication product with the electronic parts under the SparX?-III-25um series.During normal operation, a minimum value of -40°C is set for the temperature.It is necessary to set the temperature at the maximum value of 125°C for the telecom IC to function normally.
VSC7422XJQ-04 Features
Available in the TQFP package
SUPPORT CIRCUIT as telecom IC type
VSC7422XJQ-04 Applications
There are a lot of Microchip Technology VSC7422XJQ-04 Telecom applications.
- Home Gateway
- T2 Rates PCM Line Interface
- Routers
- PDH Multiplexers
- Wireless base stations
- Digital Access Cross-connect System (DACs)
- Fiber Optic Terminals
- Intelligent PBX
- Fiber
- E1 Multiplexer