Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Mounting Type |
Surface Mount |
Package / Case |
672-BGA |
Surface Mount |
YES |
Packaging |
Tray |
Published |
2011 |
Series |
SparX™-III-18 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
672 |
Voltage - Supply |
1V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Supply Voltage |
1V |
JESD-30 Code |
S-PBGA-B672 |
Function |
Ethernet Switch |
Temperature Grade |
OTHER |
Interface |
Serial |
Number of Circuits |
1 |
Data Rate |
1 Gbps |
Telecom IC Type |
TELECOM CIRCUIT |
Height Seated (Max) |
2.44mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
VSC7425XJG-02 Overview
In order to save space on the board, 672-BGA packages are used.To pack telecommunications equipment, the way of Tray is used.The mounting type of this telecom circuit is Surface Mount.Telecommunications equipment consists of 1 circuits.When 1V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.672 terminations can be found in the configuration.It requires a supply voltage of 1V.The type of telecom IC it uses is TELECOM CIRCUIT.With its similar functionality to electronic parts under the SparX?-III-18 series, it can perform a number of similar tasks.
VSC7425XJG-02 Features
Available in the 672-BGA package
TELECOM CIRCUIT as telecom IC type
VSC7425XJG-02 Applications
There are a lot of Microchip Technology VSC7425XJG-02 Telecom applications.
- SDH/SONET multiplexers
- NIU
- CSU/DSU E1/T1/J1 Interface
- Home Gateway
- Home Side Box
- Remote wireless modules
- PBXs channel bank
- SONET/SDH terminal
- PBX (Private Branch Exchange)
- Router