Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
672-BGA |
Surface Mount |
YES |
Packaging |
Tray |
Series |
SparX™-III-24 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
672 |
Voltage - Supply |
1V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Supply Voltage |
1V |
JESD-30 Code |
S-PBGA-B672 |
Function |
Ethernet Switch |
Temperature Grade |
OTHER |
Interface |
Serial |
Number of Circuits |
1 |
Telecom IC Type |
TELECOM CIRCUIT |
Height Seated (Max) |
2.44mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
ROHS3 Compliant |
VSC7426XJG-02 Overview
A 672-BGA package is used to reduce board space requirements.In order to pack telecommunications equipment, Tray is used.A Surface Mount mounting type is used.The telecom IC is composed of 1 circuits.Telecom circuit is possible to increase efficiency by providing 1V with a higher voltage.Configuration of the telecom circuit shows 672 terminations.It operates with a voltage of 1V.Telecom ICs of type TELECOM CIRCUIT are used in it.There are many similarities between it and the electronic parts of the SparX?-III-24 series.
VSC7426XJG-02 Features
Available in the 672-BGA package
TELECOM CIRCUIT as telecom IC type
VSC7426XJG-02 Applications
There are a lot of Microchip Technology VSC7426XJG-02 Telecom applications.
- Residential Gateways
- PCM Test Equipment
- SDH/SONET multiplexers
- Fiber to the Home (FTTH)
- Integrated Access Devices (IADs)
- Intelligent PBX
- LAN Routers
- Multichannel DS1 Test Equipment
- M13 MUX
- E1 Multiplexer