Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Mounting Type |
Surface Mount |
Package / Case |
672-BGA |
Surface Mount |
YES |
Packaging |
Tray |
Published |
2011 |
Series |
SparX™-III-26 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
672 |
Voltage - Supply |
1V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Supply Voltage |
1V |
JESD-30 Code |
S-PBGA-B672 |
Function |
Ethernet Switch |
Temperature Grade |
OTHER |
Interface |
Serial |
Number of Circuits |
1 |
Data Rate |
1 Gbps |
Telecom IC Type |
TELECOM CIRCUIT |
Height Seated (Max) |
2.44mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
VSC7427XJG-02 Overview
To save board space, the 672-BGA package is used.Telecommunications equipment is packed using the Tray method.A Surface Mount-mount is used for mounting the telecom circuit.Telecommunications equipment consists of 1 circuits.The voltage supplied to 1V can improve efficiency.In telecom switching configuration, 672 terminations are present.A 1V supply voltage is required to operate it.It adopts TELECOM CIRCUIT as its telecom IC type.With the SparX?-III-26 series electronic parts, it can perform similar functions of the telecommunication product .
VSC7427XJG-02 Features
Available in the 672-BGA package
TELECOM CIRCUIT as telecom IC type
VSC7427XJG-02 Applications
There are a lot of Microchip Technology VSC7427XJG-02 Telecom applications.
- Channel Banks
- Multichannel DS1 Test Equipment
- Switches
- Fiber to the Home (FTTH)
- Central office (CO)
- Digital Modems
- Router
- Residential Gateways
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- T1/E1/J1 Multiplexer and Channel Banks