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VSC7435XMT

Telecom device


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-VSC7435XMT
  • Package: 324-BGA
  • Datasheet: PDF
  • Stock: 943
  • Description: Telecom device(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 324-BGA
Supplier Device Package 324-BGA (19x19)
Packaging Tray
Published 2017
Series Servalâ„¢-TE
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
RoHS Status ROHS3 Compliant

VSC7435XMT Overview


Space is saved on the board by using the 324-BGA package.For telecommunications equipment packing, the Tray method is used.Surface Mount is used as telecommunications equipment mounting type.With the Serval?-TE series electronic parts, it can perform similar functions of the telecommunication product .

VSC7435XMT Features


Available in the 324-BGA package

VSC7435XMT Applications


There are a lot of Microchip Technology VSC7435XMT Telecom applications.

  • PBX interfaces
  • ISDN Primary Rate Interface
  • ISDN NT1/TA
  • Fiber
  • Central office
  • Channel Banks
  • T1 Rates PCM Line Interface
  • CSU/DSU Equipment
  • Inverse Multiplexing for ATM (IMA)
  • Remote wireless modules

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