VSC8254YMR-01
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 256-BBGA, FCBGA |
| Supplier Device Package | 256-FCBGA (17x17) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 970mV 1.2V |
| Function | Ethernet |
| Interface | SPI |
| Number of Circuits | 2 |
| RoHS Status | ROHS3 Compliant |
VSC8254YMR-01 Overview
In order to save space on the board, the 256-BBGA, FCBGA package is used.Telecommunications equipment is packed using the Tray method.There is a type Surface Mount mount for this telecom circuit.An 2-circuit makes up this telecom IC .When the voltage for 970mV 1.2V is provided, improved efficiency can be achieved.
VSC8254YMR-01 Features
Available in the 256-BBGA, FCBGA package
VSC8254YMR-01 Applications
There are a lot of Microchip Technology VSC8254YMR-01 Telecom applications.
- Add/Drop multiplexers (ADMs)
- Cross Connects
- Inverse Multiplexing for ATM (IMA)
- T1 Rates PCM Line Interface
- PBX (Private Branch Exchange)
- Wireless local loop (WLL)
- Central office (CO)
- Wireless Local Loop
- Fiber
- Microwave transmission systems
