VSC8490YJU-17
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 196-LBGA, FCBGA |
| Supplier Device Package | 196-FCBGA (15x15) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 1V 1.2V |
| Function | Ethernet |
| Interface | SPI |
| Number of Circuits | 2 |
| RoHS Status | ROHS3 Compliant |
VSC8490YJU-17 Overview
A 196-LBGA, FCBGA package is used to reduce board space requirements.For telecommunications equipment packing, the Tray method is used.Mounting type Surface Mount is used.A 2-circuit composes this telecom IC .Telecom circuit is possible to increase efficiency by providing 1V 1.2V with a higher voltage.
VSC8490YJU-17 Features
Available in the 196-LBGA, FCBGA package
VSC8490YJU-17 Applications
There are a lot of Microchip Technology VSC8490YJU-17 Telecom applications.
- Central office (CO)
- Public switching systems
- Add/Drop multiplexers (ADMs)
- Remote wireless modules
- SDH Multiplexers
- E1 LAN/WAN Routers
- Fault Tolerant Systems
- Digital subscriber line access multiplexer (DSLAM)
- T3 channelized access concentrators
- T1/E1/J1 LAN/WAN Routers
