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VSC8501XML-03

Telecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-VSC8501XML-03
  • Package: QFN
  • Datasheet: PDF
  • Stock: 667
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 135-QFN (12x12)
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Max Operating Temperature 125°C
Min Operating Temperature -40°C
Voltage - Supply 3.3V
Function Ethernet
Interface Ethernet
Number of Circuits 1
RoHS Status ROHS3 Compliant

VSC8501XML-03 Overview


Saving board space is achieved with the QFN package.Packing is done according to the Tray method.A Surface Mount mounting type is used.1 circuits are used in this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 3.3V can be operated more efficiently.A minimum temperature value -40°C is set to ensure normal operation.Ensure normal operation by setting the temperature to the maximum value of 125°C.

VSC8501XML-03 Features


Available in the QFN package

VSC8501XML-03 Applications


There are a lot of Microchip Technology VSC8501XML-03 Telecom applications.

  • ISDN Primary Rate Interfaces (PRA)
  • CSU/DSU Equipment
  • Voice over packet gateways
  • E1 Multiplexer
  • PBX interfaces
  • Cable PC
  • Digital cross connects (DSX-1)
  • Network Multiplexing and Terminating Equipment
  • BITS Timing
  • SDH Multiplexers

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