Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Mounting Type |
Surface Mount |
Package / Case |
QFN |
Supplier Device Package |
135-QFN (12x12) |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Max Operating Temperature |
125°C |
Min Operating Temperature |
-40°C |
Voltage - Supply |
3.3V |
Function |
Ethernet |
Interface |
Ethernet |
Number of Circuits |
1 |
RoHS Status |
ROHS3 Compliant |
VSC8501XML-03 Overview
Saving board space is achieved with the QFN package.Packing is done according to the Tray method.A Surface Mount mounting type is used.1 circuits are used in this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 3.3V can be operated more efficiently.A minimum temperature value -40°C is set to ensure normal operation.Ensure normal operation by setting the temperature to the maximum value of 125°C.
VSC8501XML-03 Features
Available in the QFN package
VSC8501XML-03 Applications
There are a lot of Microchip Technology VSC8501XML-03 Telecom applications.
- ISDN Primary Rate Interfaces (PRA)
- CSU/DSU Equipment
- Voice over packet gateways
- E1 Multiplexer
- PBX interfaces
- Cable PC
- Digital cross connects (DSX-1)
- Network Multiplexing and Terminating Equipment
- BITS Timing
- SDH Multiplexers