VSC8501XML
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | QFN |
| Supplier Device Package | 135-QFN (12x12) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | 0°C |
| Voltage - Supply | 3.3V |
| Function | Ethernet |
| Interface | Ethernet |
| Number of Circuits | 1 |
| Data Rate | 1 Gbps |
| RoHS Status | ROHS3 Compliant |
VSC8501XML Overview
The QFN package reduces the amount of space on a board.Telecommunications equipment is packed in the Tray-way.Mounting type Surface Mount is used.1 circuits are used in this telecom IC .3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The temperature is set at the minimum value of 0°C to ensure normal operation.Ensure normal operation by setting the temperature to the maximum value of 125°C.
VSC8501XML Features
Available in the QFN package
VSC8501XML Applications
There are a lot of Microchip Technology VSC8501XML Telecom applications.
- Intelligent PBX
- Multiplexers
- CSU/DSU E1 Interface
- Residential Gateways
- Fiber
- Fault Tolerant Systems
- SDH Multiplexers
- BITS Timing
- Fractional T1/E1/J1
- T1/E1/J1 Performance Monitoring
