VSC8502XML-03
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | QFN |
| Supplier Device Package | 135-QFN (12x12) |
| Packaging | Tray |
| Published | 2010 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Max Operating Temperature | 125°C |
| Min Operating Temperature | -40°C |
| Voltage - Supply | 3.3V |
| Function | Ethernet |
| Interface | Ethernet |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
VSC8502XML-03 Overview
QFN package is used to save board space.Telecommunications equipment is packed in the Tray-way.Mounting type Surface Mount is used.The telecom IC is composed of 1 circuits.3.3V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.The temperature is set at the minimum value of -40°C to ensure normal operation.The temperature is set at the maximum value of 125°C to ensure normal operation.
VSC8502XML-03 Features
Available in the QFN package
VSC8502XML-03 Applications
There are a lot of Microchip Technology VSC8502XML-03 Telecom applications.
- Central office
- Cable PC
- Short/Medium Loop
- Digital cross connects (DSX-1)
- T1/E1/J1 LAN/WAN Routers
- T1 Digital Cross Connects (DSX-1)
- Multi-Line E1 Interface Cards
- Fiber to the Home (FTTH)
- Digital Modems
- Integrated Multi-Service Access Platforms (IMAPs)
