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VSC8502XML

Telecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-VSC8502XML
  • Package: QFN
  • Datasheet: PDF
  • Stock: 874
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mounting Type Surface Mount
Package / Case QFN
Supplier Device Package 135-QFN (12x12)
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Max Operating Temperature 125°C
Min Operating Temperature 0°C
Voltage - Supply 3.3V
Function Ethernet
Interface Ethernet
Number of Circuits 1
Data Rate 1 Gbps
RoHS Status ROHS3 Compliant

VSC8502XML Overview


The QFN package reduces the amount of space on a board.Telecommunications equipment is packed in the Tray-way.Surface Mount is used as telecommunications equipment mounting type.An 1-circuit makes up this telecom IC .The voltage supplied to 3.3V can improve efficiency.In order to ensure normal operation, the temperature is set to the minimum value of 0°C.In order to maintain normal operation, 125°C must be set at its maximum value.

VSC8502XML Features


Available in the QFN package

VSC8502XML Applications


There are a lot of Microchip Technology VSC8502XML Telecom applications.

  • Central office
  • Digital subscriber line access multiplexer (DSLAM)
  • Channel Banks
  • Cable Modem
  • Fractional T1/E1/J1
  • SDH/SONET multiplexers
  • Fiber
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Fiber in the loop (FITL)
  • Public switching systems

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