VSC8504XKS-01
| Parameters | |
|---|---|
| Lifecycle Status | LIMITED TIME BUY (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 256 |
| Voltage - Supply | 1V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1V |
| JESD-30 Code | S-PBGA-B256 |
| Function | Ethernet |
| Temperature Grade | OTHER |
| Number of Circuits | 1 |
| Data Rate | 1 Gbps |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
VSC8504XKS-01 Overview
Space is saved on the board by using the 256-BGA package.The way of Tray is employed for telecommunications equipment packing.In this case, Surface Mount is the mounting type.Telecom circuit is made up of 1 circuits.Improved efficiency can be ensured when the supply voltage of 1V is provided.Configuration of this telecom circuit has 256 terminations.It operates at voltage 1V.
VSC8504XKS-01 Features
Available in the 256-BGA package
VSC8504XKS-01 Applications
There are a lot of Microchip Technology VSC8504XKS-01 Telecom applications.
- Channel Service Units (CSUs): T1/E1/J1
- Channel Banks
- DSLAMs
- T3 channelized access concentrators
- PBXs channel bank
- DECT (Digital European Cordless Telephone) Base Stations
- Fiber in the loop (FITL)
- CSU/DSU E1/T1/J1 Interface
- Voice over packet gateways
- T1/E1/J1 Performance Monitoring
