Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
256-BGA |
Supplier Device Package |
256-PBGA (17x17) |
Packaging |
Tray |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Voltage - Supply |
1V |
Function |
Ethernet |
Number of Circuits |
1 |
RoHS Status |
ROHS3 Compliant |
VSC8504XKS-02 Overview
Space is saved on the board by using the 256-BGA package.For packing, Tray is used.Telecommunications equipment is mounted with type Surface Mount.1 circuits are used in this telecom IC .Wtelecom IC's efficiencyh a high supply voltage, 1V can be operated more efficiently.
VSC8504XKS-02 Features
Available in the 256-BGA package
VSC8504XKS-02 Applications
There are a lot of Microchip Technology VSC8504XKS-02 Telecom applications.
- Digital subscriber line access multiplexer (DSLAM)
- M13 MUX
- Digital Cross-connect Systems (DCS)
- PCM channel bank
- Set-Top Box
- ISDN NT1/TA
- DECT (Digital European Cordless Telephone) Base
- SONET/SDH terminal
- Cable modem
- E1 Rates PCM Line Interface