VSC8531XMW
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 48-VFQFN Exposed Pad |
| Supplier Device Package | 48-QFN (6x6) |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Function | Ethernet |
| Interface | RMII |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
VSC8531XMW Overview
Saving board space is achieved with the 48-VFQFN Exposed Pad package.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.Telecommunications equipment consists of 1 circuits.At -40°C~125°C, reliable performance can be achieved.
VSC8531XMW Features
Available in the 48-VFQFN Exposed Pad package
VSC8531XMW Applications
There are a lot of Microchip Technology VSC8531XMW Telecom applications.
- Short/Medium Loop
- Network Multiplexing and Terminating Equipment
- T1 Digital Cross Connects (DSX-1)
- Digital cross connects (DSX-1)
- CSU/DSU E1/T1/J1 Interface
- E2 Rates PCM Line Interface
- Frame Relay Switches and Access Devices (FRADS)
- High speed data transmission line cards
- SDH Multiplexers
- High-Density T1/E1/J1 interfaces for Multiplexers
