Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
68-VFQFN Exposed Pad |
Supplier Device Package |
68-QFN (8x8) |
Operating Temperature |
-40°C~125°C |
Packaging |
Tray |
Published |
2009 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Function |
Ethernet |
Interface |
RMII |
Number of Circuits |
1 |
RoHS Status |
ROHS3 Compliant |
VSC8541XMV-01 Overview
The 68-VFQFN Exposed Pad package reduces the amount of space on a board.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.An 1-circuit makes up this telecom IC .Operating temperatures of -40°C~125°C can ensure reliable performance.
VSC8541XMV-01 Features
Available in the 68-VFQFN Exposed Pad package
VSC8541XMV-01 Applications
There are a lot of Microchip Technology VSC8541XMV-01 Telecom applications.
- Home Side Box
- T1/E1/J1 Performance Monitoring
- Integrated Multi-Service Access Platforms (IMAPs)
- Network Multiplexing and Terminating Equipment
- Channel Banks
- Digital Cross-Connect Systems
- SONET/SDH terminal
- E2 Rates PCM Line Interface
- E3/DS3 Access Equipment
- DECT (Digital European Cordless Telephone) Base