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VSC8541XMV-01

Telecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-VSC8541XMV-01
  • Package: 68-VFQFN Exposed Pad
  • Datasheet: -
  • Stock: 770
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 68-VFQFN Exposed Pad
Supplier Device Package 68-QFN (8x8)
Operating Temperature -40°C~125°C
Packaging Tray
Published 2009
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Ethernet
Interface RMII
Number of Circuits 1
RoHS Status ROHS3 Compliant

VSC8541XMV-01 Overview


The 68-VFQFN Exposed Pad package reduces the amount of space on a board.Telecommunications equipment is packed using the Tray method.A Surface Mount mounting type is used.An 1-circuit makes up this telecom IC .Operating temperatures of -40°C~125°C can ensure reliable performance.

VSC8541XMV-01 Features


Available in the 68-VFQFN Exposed Pad package

VSC8541XMV-01 Applications


There are a lot of Microchip Technology VSC8541XMV-01 Telecom applications.

  • Home Side Box
  • T1/E1/J1 Performance Monitoring
  • Integrated Multi-Service Access Platforms (IMAPs)
  • Network Multiplexing and Terminating Equipment
  • Channel Banks
  • Digital Cross-Connect Systems
  • SONET/SDH terminal
  • E2 Rates PCM Line Interface
  • E3/DS3 Access Equipment
  • DECT (Digital European Cordless Telephone) Base

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