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VSC8541XMV-03

Telecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-VSC8541XMV-03
  • Package: -
  • Datasheet: -
  • Stock: 459
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Supplier Device Package 68-QFN (8x8)
Operating Temperature -40°C~125°C
Packaging Tray
Published 2009
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Ethernet
Interface RMII
Number of Circuits 1
RoHS Status ROHS3 Compliant
Lead Free Lead Free

VSC8541XMV-03 Overview


In order to pack telecommunications equipment, Tray is used.Telecommunications equipment is mounted with type Surface Mount.1 circuits make up this telecom IC .Using -40°C~125°C as the operating temperature can result in reliable performance.

VSC8541XMV-03 Features



VSC8541XMV-03 Applications


There are a lot of Microchip Technology VSC8541XMV-03 Telecom applications.

  • Residential Gateways
  • CSU/DSU E1 Interface
  • DECT (Digital European Cordless Telephone) Base Stations
  • T1/E1/J1 LAN/WAN Routers
  • PDH Multiplexers
  • Central office (CO)
  • Switching Systems
  • DECT (Digital European Cordless Telephone) Base
  • Fault Tolerant Systems
  • Home Side Box

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