Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Supplier Device Package |
68-QFN (8x8) |
Operating Temperature |
-40°C~125°C |
Packaging |
Tray |
Published |
2009 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Function |
Ethernet |
Interface |
RMII |
Number of Circuits |
1 |
RoHS Status |
ROHS3 Compliant |
Lead Free |
Lead Free |
VSC8541XMV-03 Overview
In order to pack telecommunications equipment, Tray is used.Telecommunications equipment is mounted with type Surface Mount.1 circuits make up this telecom IC .Using -40°C~125°C as the operating temperature can result in reliable performance.
VSC8541XMV-03 Features
VSC8541XMV-03 Applications
There are a lot of Microchip Technology VSC8541XMV-03 Telecom applications.
- Residential Gateways
- CSU/DSU E1 Interface
- DECT (Digital European Cordless Telephone) Base Stations
- T1/E1/J1 LAN/WAN Routers
- PDH Multiplexers
- Central office (CO)
- Switching Systems
- DECT (Digital European Cordless Telephone) Base
- Fault Tolerant Systems
- Home Side Box