VSC8552XKS-02
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-PBGA (17x17) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 1V |
| Function | Ethernet |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
VSC8552XKS-02 Overview
Board space can be saved by using the 256-BGA package.The way of Tray is employed for telecommunications equipment packing.There is a type Surface Mount mount for this telecom circuit.A 1-circuit composes this telecom IC .1V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.
VSC8552XKS-02 Features
Available in the 256-BGA package
VSC8552XKS-02 Applications
There are a lot of Microchip Technology VSC8552XKS-02 Telecom applications.
- E1 Rates PCM Line Interface
- T1/E1/J1 add/drop multiplexers (MUX)
- ISDN terminal adapter
- Integrated Access Devices (IADs)
- Digital loop carrier (DLC)
- Cable Telephony
- High speed data transmission line cards
- PCM channel bank
- Central office (CO)
- ISDN Primary Rate Interface
