VSC8564XKS-11
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-PBGA (17x17) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| RoHS Status | ROHS3 Compliant |
VSC8564XKS-11 Overview
A 256-BGA package saves space on a board.Packing is done according to the Tray method.The mounting type is Surface Mount.
VSC8564XKS-11 Features
Available in the 256-BGA package
VSC8564XKS-11 Applications
There are a lot of Microchip Technology VSC8564XKS-11 Telecom applications.
- High speed data transmission line cards
- DECT (Digital European Cordless Telephone) Base Stations
- E1 Multiplexer
- Digital Modems
- Digital Cross-connect Systems (DCS)
- Fault Tolerant Systems
- Dual battery supply voltage SLICs
- Public switching systems
- Fiber to the Home (FTTH)
- T1/E1/J1 Multiplexer and Channel Banks
