VSC8572XKS-02
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-PBGA (17x17) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 1V 2.5V |
| Function | Ethernet |
| Interface | RMII |
| Number of Circuits | 2 |
| RoHS Status | ROHS3 Compliant |
VSC8572XKS-02 Overview
A 256-BGA package saves space on a board.Packing is done according to the Tray method.The mounting type is Surface Mount.A 2 circuit is the heart of this telecom IC .When 1V 2.5V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.
VSC8572XKS-02 Features
Available in the 256-BGA package
VSC8572XKS-02 Applications
There are a lot of Microchip Technology VSC8572XKS-02 Telecom applications.
- Intelligent PBX
- Digital cross connects (DSX-1)
- Residential Gateways
- Multichannel DS1 Test Equipment
- T1/E1/J1 Performance Monitoring
- Fiber Optic Terminals
- Fiber in the loop (FITL)
- Network Multiplexing and Terminating Equipment
- Digital subscriber line access multiplexer (DSLAM)
- E2 Rates PCM Line Interface
