VSC8572XKS-04
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-PBGA (17x17) |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Voltage - Supply | 1V 2.5V |
| Function | Ethernet |
| Interface | RMII |
| Number of Circuits | 2 |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
VSC8572XKS-04 Overview
In order to save space on the board, the 256-BGA package is used.Packing is done according to the Tray method.Telecommunications equipment is mounted using Surface Mount.Telecommunications equipment consists of 2 circuits.When the voltage for 1V 2.5V is provided, improved efficiency can be achieved.
VSC8572XKS-04 Features
Available in the 256-BGA package
VSC8572XKS-04 Applications
There are a lot of Microchip Technology VSC8572XKS-04 Telecom applications.
- Microwave transmission systems
- Fiber
- Set-Top Box
- Add/Drop multiplexers (ADMs)
- Routers
- Frame Relay Switches and Access Devices (FRADS)
- Central office (CO)
- Intelligent PBX
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- Cross Connects
