VSC8582XKS-11
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 256 |
| Voltage - Supply | 1V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1V |
| Reach Compliance Code | unknown |
| JESD-30 Code | S-PBGA-B256 |
| Function | Ethernet |
| Interface | GMII, SerDes, SPI, TBI |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
VSC8582XKS-11 Overview
Board space can be saved by using the 256-BGA package.Packing is done according to the Tray method.Surface Mount is used as telecommunications equipment mounting type.Telecommunications equipment consists of 1 circuits.Wtelecom IC's efficiencyh a high supply voltage, 1V can be operated more efficiently.At -40°C~125°C, reliable performance can be achieved.Configuration of the telecom circuit shows 256 terminations.It requires a supply voltage of 1V.
VSC8582XKS-11 Features
Available in the 256-BGA package
VSC8582XKS-11 Applications
There are a lot of Microchip Technology VSC8582XKS-11 Telecom applications.
- Central office
- T1/E1/J1 add/drop multiplexers (MUX)
- Digital cross connects (DSX-1)
- E1 Network Equipment
- T1/E1/J1 Performance Monitoring
- Digital access cross connects
- Channel Banks
- SONET/SDH terminal
- Add/Drop multiplexers (ADMs)
- Short/Medium Loop
