VSC8582XKS-14
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 256 |
| Voltage - Supply | 1V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1V |
| Reach Compliance Code | unknown |
| JESD-30 Code | S-PBGA-B256 |
| Function | Ethernet |
| Interface | GMII, SerDes, SPI, TBI |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
VSC8582XKS-14 Overview
Space is saved on the board by using the 256-BGA package.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.1 circuits make up this telecom IC .When the voltage for 1V is provided, improved efficiency can be achieved.A temperature setting of -40°C~125°C ensures reliable performance.In telecom switching configuration, there are 256 terminations.1V is its supply voltage.
VSC8582XKS-14 Features
Available in the 256-BGA package
VSC8582XKS-14 Applications
There are a lot of Microchip Technology VSC8582XKS-14 Telecom applications.
- Digital subscriber line access multiplexer (DSLAM)
- E2 Rates PCM Line Interface
- T1/E1/J1 Multiplexer and Channel Banks
- Integrated Access Devices
- T1/E1/J1 Performance Monitoring
- ISDN terminal adapter
- T3 channelized access concentrators
- T2 Rates PCM Line Interface
- Dual battery supply voltage SLICs
- PBX (Private Branch Exchange)
