VSC8584XKS-14
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Packaging | Tray |
| Published | 2016 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Voltage - Supply | 1V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 2.5V |
| Reach Compliance Code | unknown |
| JESD-30 Code | S-PBGA-B256 |
| Function | Ethernet |
| Operating Temperature (Min) | -40°C |
| Temperature Grade | AUTOMOTIVE |
| Interface | GMII, SerDes, SPI, TBI |
| Number of Circuits | 1 |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
VSC8584XKS-14 Overview
Space is saved on the board by using the 256-BGA package.To pack telecommunications equipment, the way of Tray is used.Telecommunications equipment is mounted using Surface Mount.1 circuits are used in this telecom IC .Telecom circuit is possible to increase efficiency by providing 1V with a higher voltage.Configuration of this telecom circuit has 256 terminations.A 2.5V supply voltage is required to operate it.A minimum operating temperature of -40°C is supported.
VSC8584XKS-14 Features
Available in the 256-BGA package
VSC8584XKS-14 Applications
There are a lot of Microchip Technology VSC8584XKS-14 Telecom applications.
- Integrated Access Devices (IADs)
- Residential Gateways
- Codec function on telephone switch line cards
- T1/E1/J1 add/drop multiplexers (MUX)
- PBX (Private Branch Exchange)
- Interfaces to DS3
- NIU
- Cable PC
- Digital Access Cross-connect System (DACs)
- Network Multiplexing and Terminating Equipment
