VSC8662XIC-03
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Package / Case | 256-BGA |
| Surface Mount | YES |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Max Operating Temperature | 100°C |
| Min Operating Temperature | -40°C |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Supply Voltage | 1.2V |
| JESD-30 Code | S-PBGA-B256 |
| Function | Ethernet |
| Temperature Grade | INDUSTRIAL |
| Number of Circuits | 1 |
| Data Rate | 1.25 Gbps |
| Number of Transceivers | 2 |
| Height Seated (Max) | 2mm |
| RoHS Status | ROHS3 Compliant |
VSC8662XIC-03 Overview
A 256-BGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.Mounting type Surface Mount is used.The telecom IC is composed of 1 circuits.Telecom switching configuration has 256 terminations.It operates at a voltage of 1.2V.A minimum temperature value -40°C is set to ensure normal operation.A maximum value of 100°C is set to ensure normal operation.Transceivers 2 are integrated into telecommunication tools.
VSC8662XIC-03 Features
Available in the 256-BGA package
2 transceivers
VSC8662XIC-03 Applications
There are a lot of Microchip Technology VSC8662XIC-03 Telecom applications.
- Remote wireless modules
- Frame Relay Switches and Access Devices (FRADS)
- Integrated Access Devices (IADs)
- E1 Rates PCM Line Interface
- NIU
- Integrated Multi-Service Access Platforms (IMAPs)
- CSU/DSU Equipment
- Fractional T1/E1/J1
- Digital cross connects (DSX-1)
- Switching Systems
