VSC8664XIC
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Mounting Type | Surface Mount |
| Package / Case | BGA |
| Supplier Device Package | 256-BGA (17x17) |
| Packaging | Tray |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Max Operating Temperature | 90°C |
| Min Operating Temperature | 0°C |
| Function | Ethernet |
| Number of Circuits | 1 |
| Data Rate | 1.25 Gbps |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
VSC8664XIC Overview
BGA package is used to save board space.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.The telecom IC is composed of 1 circuits.Ensure normal operation by setting the temperature to 0°C minimum.The temperature is set at the maximum value of 90°C to ensure normal operation.
VSC8664XIC Features
Available in the BGA package
VSC8664XIC Applications
There are a lot of Microchip Technology VSC8664XIC Telecom applications.
- Network Multiplexing and Terminating Equipment
- Interfaces to E3
- Fiber to the Home (FTTH)
- Switches
- E1 LAN/WAN Routers
- Hybrid fiber coax (HFC)
- Stations
- Cable modem
- Fault Tolerant Systems
- Central office
