Parameters | |
---|---|
Mount | Solder Pad |
Shape | Rectangular |
Packaging | Cut Tape (CT) |
Published | 2016 |
Size / Dimension | 0.098Lx0.063W 2.50mmx1.60mm |
Part Status | Discontinued |
Moisture Sensitivity Level (MSL) | 2A (4 Weeks) |
Number of Terminations | 4 |
Termination | Solder Pads |
ECCN Code | EAR99 |
Type | MEMS (Silicon) |
Voltage - Rated | 1.8V |
HTS Code | 8542.39.00.01 |
Technology | CMOS |
Terminal Form | BUTT |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Number of Functions | 1 |
Depth | 1.6mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | R-XBGA-B4 |
Operating Temperature (Max) | 100°C |
Operating Temperature (Min) | -40°C |
Output Type | Analog |
Temperature Grade | INDUSTRIAL |
Max Supply Voltage | 3.6V |
Min Supply Voltage | 1.6V |
Operating Supply Current | 60μA |
Direction | Omnidirectional |
Voltage Range | 1.6V~3.6V |
Frequency Range | 70Hz~15kHz |
Sensitivity | -38dB ±1dB @ 94dB SPL |
Port Location | Bottom |
S/N Ratio | 63dB |
Height | 900μm |
Length | 2.5mm |
RoHS Status | RoHS Compliant |