Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
400-LFBGA, CSPBGA |
Number of Pins |
400 |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2010 |
Series |
Automotive, AEC-Q100, Zynq®-7000 XA |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
400 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Subcategory |
Other uPs/uCs/Peripheral ICs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Terminal Pitch |
0.8mm |
Frequency |
667MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1V |
Power Supplies |
11.8V |
Interface |
CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Primary Attributes |
Artix™-7 FPGA, 85K Logic Cells |
UV Erasable |
N |
Height Seated (Max) |
1.6mm |
Length |
17mm |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor Dual ARM? Cortex?-A9 MPCore? with CoreSight? is embedded in this SoC.It has been assigned a package 400-LFBGA, CSPBGA by its manufacturer for this system on a chip.With 256KB RAM implemented, this SoC chip provides reliable operation.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.In the Automotive, AEC-Q100, Zynq?-7000 XA series, this system on chip SoC is included.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.There is one thing to note about this SoC security: it combines Artix?-7 FPGA, 85K Logic Cells.Housed in the state-of-art Tray package.This SoC part has a total of 130 I/Os.In total, there are 400 terminations, which is great for system on a chip.There is no doubt that this system on a chip is outstanding, just as other high-quality Other uPs/uCs/Peripheral ICs will do.In order to operate system on chip, you will need 11.8V power supplies.MICROPROCESSOR CIRCUIT is used as the uPs, uCs, peripheral SoCs (any or all of them) for the board.It operates at a frequency of 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.This is the version with 400 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XA7Z020-1CLG400I System On Chip (SoC) applications.
- USB hard disk enclosure
- Healthcare
- Sports
- Digital Signal Processing
- Digital Media
- DC-input BLDC motor drive
- Multiprocessor system-on-chips (MPSoCs)
- sequence controllers
- Deep learning hardware
- System-on-chip (SoC)